Ultra-thin high-conductivity graphite pad for advanced electronics cooling.
Ultra-thin graphite thermal pad with excellent heat conductivity.
Graphite thermal pad for high-temperature electronics cooling up to 400°C.
Thin graphite thermal pad transfers heat from electronics and equipment safely.
High-performance graphite thermal pad with adhesive for extreme heat dissipation.
Self-adhesive graphite thermal pad for industrial electronics heat dissipation.
Self-adhesive graphite thermal pad for extreme heat electronics applications.
Ultra-thin graphite thermal pad with strong adhesive for electronics cooling.
Self-adhesive graphite thermal pad for cooling electronics and heat management applications.
150mm shaft for Lovato switch disconnectors.
Steel front plate for Schneider Electric PrismaSeT distribution and control enclosures.
Steel gland plate for routing cables through electrical enclosures.
Large aluminum heatsink for dissipating heat from electronic components and devices.
Large self-adhesive thermal interface sheet for electronic component heat management.
Schneider modular chassis for 64 electrical components in enclosure installations.
Thin thermal pad for heat transfer between components in electronic devices.
Medium rectangular aluminium heatsink for general purpose electronic component cooling.
Clip-mounted rectangular heatsink for moderate heat dissipation in industrial electronics.
Medium aluminum heatsink for general industrial electronic equipment cooling.
Large flat aluminum PCB heatsink for high-power semiconductor and optoelectronic cooling.
Industrial-grade aluminum heatsink for medium to high-power thermal dissipation.
Copper heat pipe for transferring heat away from electronic devices efficiently.
PCB-mounted aluminum heatsink for cooling high-power semiconductor and optoelectronic devices.
Adhesive thermal pad for electronics cooling and component mounting.
Graphite thermal pad for cooling electronics between components and heatsinks.
Silicone thermal sheet for heat transfer between electronic components.
Gel thermal pad for heat transfer between electronic components and heatsinks.
Sticky thermal pad for mounting on electronic components to remove heat.
Copper heat pipe for cooling electronic components in industrial equipment.
Self-adhesive thermal pad for cooling electronic components and processors.
Non-silicone thermal sheet for electronic component heat dissipation.
Sticky thermal pad with built-in adhesive for easy component mounting.
Self-adhesive thermal pad for easy installation on electronic components.
Thermal gel pad for cooling electronic components and processors in devices.