Large fibreglass thermal sheet for industrial electronics heat dissipation.
Large fibreglass thermal sheet for electronics cooling, 10x12 inch size.
Soft thermal interface sheet for electronics, 200x100mm with Gap Pad material.
Medium thermal interface sheet for electronics cooling applications.
Self-adhesive thermal sheet for industrial electronics heat management.
Large self-adhesive thermal sheet for broad surface electronics cooling applications.
Self-adhesive thermal interface sheet for filling gaps between electronic components and heat sinks.
Soft thermal interface sheet for gentle component mounting and heat dissipation.
Thin flexible thermal pad for gentle heat transfer in sensitive electronic applications.
Self-adhesive thermal interface for gently cooling sensitive electronic components and circuits.
Thin polyimide thermal interface for insulating yet heat-conductive electronics bonding.
Self-adhesive thermal sheet for high-temperature electronics cooling.
Fibreglass thermal pad for electronics cooling, mid-range conductivity.
White silicone sponge sheet for insulation, cushioning, and high-temperature sealing.
Thick silicone foam sheet for acoustic dampening, thermal insulation, and cushioning in machinery.
Self-adhesive thermal interface sheet for general electronics cooling and heat transfer.
Silicone foam sheet for food contact sealing and high temperature application areas.
Self-adhesive thermal interface sheet for gap filling and heat dissipation in electronic devices.
White silicone foam sheet for high-temperature insulation and sealing applications.
Self-adhesive thermal pad sheet for electronic component cooling and heat transfer.
Thin self-adhesive thermal pad for cooling gaps in industrial electronic devices.
Self-adhesive thermal interface pad for reliable heat dissipation in electronics.
Self-adhesive thermal gap pad for electronic device cooling and heat management.
Food-grade silicone sponge for high-temperature sealing in kitchens, processing plants, and appliances.
Soft thermal interface pad for filling gaps in equipment heat transfer paths.
Thin flexible thermal pad for bridging gaps in electronic cooling applications.
Self-adhesive thermal pad for cooling electronic components in industrial equipment.
Ultra-thin thermal interface pad for low-profile electronic component cooling.
Self-adhesive thermal pad with medium conductivity for general electronics cooling.
Soft self-adhesive thermal pad for bridging gaps between heat-generating electronics and cooling surfaces.
Compressible thermal pad for filling gaps between components and heatsinks.
Self-adhesive thermal pad for moderate conductivity electronic component cooling.
Self-adhesive thermal gap filler pad for electronic equipment heat management.
Self-adhesive thermal gap filler pad for electronic component heat management.