Adhesive-backed compact heatsink for direct mounting on BGA semiconductor devices.

Small aluminum heatsink with adhesive for chip cooling.

Small rectangular aluminum heatsink with adhesive backing for electronic chips.

Aluminum heatsink for cooling high-power electronic components on circuit boards.

Small adhesive heatsink for cooling semiconductor devices and BGA components.

Small adhesive-backed aluminium heatsink for semiconductor thermal management.

Large PCB-mounted aluminum heatsink for high-power semiconductor thermal management.

Adhesive-backed aluminum heatsink for direct chip mounting.

Medium aluminum heatsink for general semiconductor cooling.

Large aluminum heatsink for high-power semiconductor cooling.

Large clamped aluminium heatsink for high-power semiconductor cooling.

Large high-performance aluminum heatsink for power semiconductor devices.

Large PCB-mounted aluminium heatsink for high-power semiconductor devices.

Large rectangular aluminum heatsink for PCB-mounted high-power semiconductors.

PCB-mounted aluminum heatsink for high-power semiconductors and optoelectronic devices.

Large aluminum heatsink for high-power semiconductor cooling on circuit boards.

Medium-sized aluminium heatsink for general semiconductor and power device cooling.

Medium aluminum PCB heatsink for high-power devices and semiconductor thermal management.

Large flat aluminum PCB heatsink for high-power semiconductor and optoelectronic cooling.

Medium rectangular PCB-mounted aluminum heatsink for high-power semiconductor devices.

Large aluminum heatsink with very low thermal resistance for high-power semiconductor cooling.