ACG
Loading
PART OF THE NOVA PLATFORM ECOSYSTEM · KAMPALA, UGANDA · MALATYA, TURKEY
Browse by Department
Services About Contact
Submit RFQ →
You searched for "GPU thermal management"
15,362 products found · 5 categories · Top brands: RS PRO· Schneider Electric· ZEBRA· HellermannTyton
Showing 1–40 of 15,362 products
Bergquist Thermal Interface Pad, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 11.1 x 7.92mm
Bergquist Bergquist Thermal Interface Pad, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 11.1 x 7.92mm Part: QII-0.006-00-50

Thin thermal pad for cooling electronics and processors in high-temperature environments.

RITTAL MANAGE-IT CABLE MANAGER - RACK CABLE MANAGEMENT KIT - 1U
RITTAL RITTAL MANAGE-IT CABLE MANAGER - RACK CABLE MANAGEMENT KIT - 1U Part: 9969736

1U horizontal cable management kit for organizing cables in server racks.

Intelligent LED Solutions Thermal Interface Sheet, 0.13mm Thick, 5 W/m·K, 240 W/m·K, TIM
Intelligent LED Solutions Intelligent LED Solutions Thermal Interface Sheet, 0.13mm Thick, 5 W/m·K, 240 W/m·K, TIM Part: ILA-TIM-17FL-215X194-0A

High-conductivity thermal interface material for LED and electronics heat dissipation.

TSC TTP-247 - LABEL PRINTER - B/W - DIRECT THERMAL / THERMAL TRANSFER 99-125A013-0001
TSC TSC TTP-247 - LABEL PRINTER - B/W - DIRECT THERMAL / THERMAL TRANSFER 99-125A013-0001 Part: 99-125A013-0001

Very fast label printer with both direct thermal and transfer modes for flexible labeling.

BIXOLON XT5-40S 4" THERMAL TRANSFER/DIRECT THERMAL INDUSTRIAL LABEL PRINTER XT5-40S
BIXOLON BIXOLON XT5-40S 4" THERMAL TRANSFER/DIRECT THERMAL INDUSTRIAL LABEL PRINTER XT5-40S Part: XT5-40S

Industrial-grade thermal printer for high-volume label and barcode printing.

Bergquist Self-Adhesive Thermal Interface Sheet, 0.125in Thick, 2.7W/m·K, Gap Pad 2500, 200 x 100mm
Bergquist Bergquist Self-Adhesive Thermal Interface Sheet, 0.125in Thick, 2.7W/m·K, Gap Pad 2500, 200 x 100mm Part: GP2500-0.125-02-00-200X100

Self-adhesive thermal interface pad for reliable heat dissipation in electronics.

Heatsink, BGA, CPU and GPU, 32.5 x 32.5 x 7.5mm, PCB Mount
Arcol Ohmite Heatsink, BGA, CPU and GPU, 32.5 x 32.5 x 7.5mm, PCB Mount Part: BGAH325-075E

Medium-sized PCB-mounted heatsink for computer processors and GPU chips.

Cisco Meraki Cloud Managed MS125-48FP - switch - 48 ports - managed
Cisco Cisco Meraki Cloud Managed MS125-48FP - switch - 48 ports - managed Part: MS125-48FP-HW

Enterprise-grade 48-port managed network switch for office and data center connectivity.

NVIDIA TESLA M10 - GPU COMPUTING PROCESSOR - TESLA M10 HX-GPU-M10=
NVIDIA NVIDIA TESLA M10 - GPU COMPUTING PROCESSOR - TESLA M10 HX-GPU-M10= Part: HX-GPU-M10=

GPU accelerator card for intensive computing tasks and graphics processing.

Heatsink, BGA, CPU and GPU, 37.5 x 37.5 x 12.5mm, PCB Mount
Arcol Ohmite Heatsink, BGA, CPU and GPU, 37.5 x 37.5 x 12.5mm, PCB Mount Part: BGAH375-125E

Compact heatsink for CPU and GPU thermal management in electronic devices.

BRADY BRADYPRINTER I5300 - LABEL PRINTER - B/W - DIRECT THERMAL / THERMAL T 151290
BRADY BRADY BRADYPRINTER I5300 - LABEL PRINTER - B/W - DIRECT THERMAL / THERMAL T 151290 Part: 151290

Professional label printer for industrial labeling and product identification.

NVIDIA TESLA P6 - GPU COMPUTING PROCESSOR UCSB-GPU-P6-R=
NVIDIA NVIDIA TESLA P6 - GPU COMPUTING PROCESSOR UCSB-GPU-P6-R= Part: UCSB-GPU-P6-R=

GPU accelerator card for high-performance computing and data processing.

Wurth Elektronik Thermal Gap Pad, 3mm Thick, 400 x 200 x 3mm
Wurth Elektronik Wurth Elektronik Thermal Gap Pad, 3mm Thick, 400 x 200 x 3mm Part: 40006030

Thermal gap pad for heat transfer between electronic components and heat sinks.

HPE Aruba 6400 Management Module - network management device
HPE HPE Aruba 6400 Management Module - network management device Part: R0X31A

Plug-in management module for HPE Aruba network switch and router systems.

Wurth Elektronik Thermal Gap Pad, 1mm Thick, 400 x 200 x 1mm
Wurth Elektronik Wurth Elektronik Thermal Gap Pad, 1mm Thick, 400 x 200 x 1mm Part: 40102010

Heat dissipation pad for electronic components, transfers heat away from processors and chipsets.

LENOVO FLEX SYSTEM CHASSIS MANAGEMENT MODULE 2 - NETWORK MANAGEMENT DEVICE 00FJ669
LENOVO LENOVO FLEX SYSTEM CHASSIS MANAGEMENT MODULE 2 - NETWORK MANAGEMENT DEVICE 00FJ669 Part: 00FJ669

Lenovo Flex System chassis management module for blade server network administration.

Heatsink, BGA, CPU and GPU, 15 x 15 x 12.5mm, PCB Mount
Arcol Ohmite Heatsink, BGA, CPU and GPU, 15 x 15 x 12.5mm, PCB Mount Part: BGAH150-125E

Taller PCB-mounted heatsink for processors and graphics chips requiring better cooling.

ANYWHERE PREMIUM 36 BAY SECURE SMART MANAGE CHARGING CART AC-MANAGE
ANYWHERE ANYWHERE PREMIUM 36 BAY SECURE SMART MANAGE CHARGING CART AC-MANAGE Part: AC-MANAGE

Smart-managed secure charging cart for thirty-six devices with control software.

HPE NETWORK MANAGEMENT MODULE - REMOTE MANAGEMENT ADAPTER - GIGABIT ETHERNE Q1C17A
HPE HPE NETWORK MANAGEMENT MODULE - REMOTE MANAGEMENT ADAPTER - GIGABIT ETHERNE Q1C17A Part: Q1C17A

HPE remote management adapter for network monitoring and server control via ethernet.

NVIDIA TESLA M10 - GPU COMPUTING PROCESSOR - TESLA M10 UCSC-GPU-M10
NVIDIA NVIDIA TESLA M10 - GPU COMPUTING PROCESSOR - TESLA M10 UCSC-GPU-M10 Part: UCSC-GPU-M10

NVIDIA graphics processor for server computing and video acceleration.

INTERMEC PD43 - LABEL PRINTER - MONOCHROME - DIRECT THERMAL / THERMAL TRANS PD43A03100010301
INTERMEC INTERMEC PD43 - LABEL PRINTER - MONOCHROME - DIRECT THERMAL / THERMAL TRANS PD43A03100010301 Part: PD43A03100010301

High-speed monochrome thermal label printer for retail and logistics labeling.

ZEBRA ZT610 - LABEL PRINTER - B/W - DIRECT THERMAL / THERMAL TRANSFER ZT61042-T010100Z
ZEBRA ZEBRA ZT610 - LABEL PRINTER - B/W - DIRECT THERMAL / THERMAL TRANSFER ZT61042-T010100Z Part: ZT61042-T010100Z

High-speed thermal label printer for barcodes and shipping labels in warehouses.

RS PRO Silicone Thermal Grease, 5W/m·K
RS PRO RS PRO Silicone Thermal Grease, 5W/m·K Part: 180-5299

Silicone-based thermal paste for cooling electronic components and heat sinks.

RS PRO Non-Silicone Thermal Grease, 3W/m·K
RS PRO RS PRO Non-Silicone Thermal Grease, 3W/m·K Part: 180-5298

Non-silicone thermal grease for cooling electronics and heat dissipation applications.

Fischer Elektronik Ceramic Synthetic Fluid Thermal Grease, 10W/m·K
Fischer Elektronik Fischer Elektronik Ceramic Synthetic Fluid Thermal Grease, 10W/m·K Part: WLPK 05

Ceramic thermal grease for cooling electronics and heat dissipation in industrial equipment.

ZEBRA ZT400 SERIES ZT411 - LABEL PRINTER - B/W - DIRECT THERMAL / THERMAL T ZT41142-T310000Z
ZEBRA ZEBRA ZT400 SERIES ZT411 - LABEL PRINTER - B/W - DIRECT THERMAL / THERMAL T ZT41142-T310000Z Part: ZT41142-T310000Z

Fast black and white thermal label printer for shipping and retail barcodes.

Wurth Elektronik Thermal Gap Pad, 1.5mm Thick, 45 x 15 x 1.5mm
Wurth Elektronik Wurth Elektronik Thermal Gap Pad, 1.5mm Thick, 45 x 15 x 1.5mm Part: 407150045015

Thermal gap pad for electronics cooling and heat dissipation in devices.

Panasonic Thermal Interface Pad, 0.25mm Thick, 180 x 180mm
Panasonic Panasonic Thermal Interface Pad, 0.25mm Thick, 180 x 180mm Part: EYGR1818ZLX2

Thin thermal pad for transferring heat between electronic components and heatsinks.

RS PRO Thermal Interface Pad, 0.127mm Thick, 2.5W/m·K, 98 x 47.5mm
RS PRO RS PRO Thermal Interface Pad, 0.127mm Thick, 2.5W/m·K, 98 x 47.5mm Part: 909-2055

Thin thermal pad for cooling electronic components between heat sources and heatsinks.

RS PRO Non-Silicone Thermal Grease, 4W/m·K
RS PRO RS PRO Non-Silicone Thermal Grease, 4W/m·K Part: 915-6118

Non-silicone thermal grease for cooling electronic components and heat dissipation applications.

Flir One Pro - Android (USB-C) - thermal and visual light camera combo modu 435-0007-03
FLIR Flir One Pro - Android (USB-C) - thermal and visual light camera combo modu 435-0007-03 Part: 435-0007-03

A handheld thermal camera that attaches to Android phones via USB-C to see heat signatures and identify electrical, plumbing, and building problems invisible to the naked eye.

RS PRO Thermal Interface Sheet, 1mm Thick, 12W/m·K, Gel, 150 x 150mm
RS PRO RS PRO Thermal Interface Sheet, 1mm Thick, 12W/m·K, Gel, 150 x 150mm Part: 707-4783

Thermal gel pad for cooling electronic components and processors in devices.

RS PRO Thermal Interface Sheet, 0.5mm Thick, 8W/m·K, Graphite, 150 x 150mm
RS PRO RS PRO Thermal Interface Sheet, 0.5mm Thick, 8W/m·K, Graphite, 150 x 150mm Part: 794-3989

Graphite thermal pad for cooling electronics between components and heatsinks.

Cisco Meraki Cloud Managed MS120-24 - switch - 24 ports - managed - rack-mountable
Cisco Cisco Meraki Cloud Managed MS120-24 - switch - 24 ports - managed - rack-mountable Part: MS120-24-HW

24-port cloud-managed switch for small business networks with simple setup.

Bergquist Self-Adhesive Thermal Interface Sheet, 0.127mm Thick, 1.6W/m·K, Fibreglass, 12 x 12in
Bergquist Bergquist Self-Adhesive Thermal Interface Sheet, 0.127mm Thick, 1.6W/m·K, Fibreglass, 12 x 12in Part: SP800-0.005-AC-1212

Self-adhesive thermal pad for cooling electronic components in industrial equipment.

RS PRO Self-Adhesive Thermal Interface Sheet, 1.5mm Thick, 2.2W/m·K, 150 x 150mm
RS PRO RS PRO Self-Adhesive Thermal Interface Sheet, 1.5mm Thick, 2.2W/m·K, 150 x 150mm Part: 707-4601

Self-adhesive thermal pad for cooling electronics and heat dissipation in devices.

NVIDIA TESLA T4 - GPU COMPUTING PROCESSOR - TESLA T4 - 16 GB HX-GPU-T4-16
NVIDIA NVIDIA TESLA T4 - GPU COMPUTING PROCESSOR - TESLA T4 - 16 GB HX-GPU-T4-16 Part: HX-GPU-T4-16

Graphics processing unit for artificial intelligence and data computation.

Electrolube TBS20S Paste Thermal Adhesive, 20 ml
Electrolube Electrolube TBS20S Paste Thermal Adhesive, 20 ml Part: TBS20S

Thermal paste adhesive for bonding metal components in heat management applications.

HPE Management Module - network management device
HPE HPE Management Module - network management device Part: J9827A

HPE network management module for device control and monitoring.

Arcol Ohmite Thermal Interface Pad, 0.5mm Thick, 3W/m·K, Silicone, 48.7x47.5mm
Arcol Ohmite Arcol Ohmite Thermal Interface Pad, 0.5mm Thick, 3W/m·K, Silicone, 48.7x47.5mm Part: HS75-TP2

Silicone thermal pad for cooling electronic components in equipment and machinery.

My RFQ Basket

Your RFQ basket is empty

Browse the catalogue and add items to your requirement list Browse catalogue