Self-adhesive thermal sheet for flexible heat dissipation, wide temperature range.
Thin self-adhesive thermal pad for filling gaps in electronic equipment cooling.
Self-adhesive thermal sheet for industrial electronics heat management.
Ultra-soft thermal pad for delicate electronics, operates up to 200°C.
Self-adhesive thermal pad for filling gaps and dissipating heat.
Self-adhesive thermal gap pad for electronic device cooling and heat management.
Thick self-adhesive thermal gap pad for industrial equipment heat dissipation.
Two-millimetre self-adhesive thermal pad for electronic component heat management.
Self-adhesive gap-filling thermal pad for electronics cooling.
Ceramic-filled thermal pad for reliable heat dissipation in electronics and semiconductor applications.
Thick thermal spacer pad for large electronics cooling and component spacing.
Ultra-thin thermal pad for minimal gap filling and device heat management.
Sticky polymer thermal pad for general electronics cooling applications.
Sticky soft thermal pad for electronics, 100mm square.
Soft sticky thermal pad for low-pressure electronics heat management.
Ultra-soft thermal pad for electronics cooling, very compressible.
Self-adhesive thermal gap filler pad for electronic component heat management.
Self-adhesive thermal pad for cooling electronic components up to 200°C.
Thick soft thermal pad for industrial equipment heat dissipation.
Medium thermal interface sheet for electronics cooling applications.
Flat ribbon cable for connecting circuit boards and compact electronic devices.
Medium-hardness thermal pad for general industrial electronics cooling.
Self-adhesive polymer thermal pad for gentle cooling of sensitive electronic devices.
Self-adhesive thermal pad for moderate conductivity electronic component cooling.
Thin self-adhesive thermal pad for cooling gaps in industrial electronic devices.
Self-adhesive thermal gap filler pad for electronic equipment heat management.
Self-adhesive thermal pad for reliable heat transfer in electronic applications.
Medium-sized aluminum heatsink with excellent thermal performance for industrial equipment.
Thick thermal pad for robust electronics heat dissipation.
Thick thermal pad for cooling electronic components in industrial equipment.
Thick thermal gap pad for spacing and heat transfer in electronic assemblies.
Thin thermal pad for heat management in compact electronic devices.
Thin thermal gap pad for compact electronics heat dissipation.
Aluminum heatsink for cooling high-power electronic components on circuit boards.