Ultra-thin high-conductivity graphite pad for advanced electronics cooling.
Graphite thermal pad for high-temperature electronics cooling up to 400°C.
High-performance graphite thermal pad with adhesive for extreme heat dissipation.
Ultra-thin graphite thermal pad with strong adhesive for electronics cooling.
Self-adhesive graphite thermal pad for extreme heat electronics applications.
Self-adhesive graphite thermal pad for cooling electronics and heat management applications.
Self-adhesive graphite thermal pad for industrial electronics heat dissipation.
Steel gland plate for routing cables through electrical enclosures.
150mm shaft for Lovato switch disconnectors.
Steel front plate for Schneider Electric PrismaSeT distribution and control enclosures.
Large aluminum heatsink for dissipating heat from electronic components and devices.
Large self-adhesive thermal interface sheet for electronic component heat management.
Schneider modular chassis for 64 electrical components in enclosure installations.
Thin thermal pad for heat transfer between components in electronic devices.
Medium rectangular aluminium heatsink for general purpose electronic component cooling.
Medium aluminum heatsink for general industrial electronic equipment cooling.
Clip-mounted rectangular heatsink for moderate heat dissipation in industrial electronics.
Industrial-grade aluminum heatsink for medium to high-power thermal dissipation.
Large flat aluminum PCB heatsink for high-power semiconductor and optoelectronic cooling.
Copper heat pipe for transferring heat away from electronic devices efficiently.
PCB-mounted aluminum heatsink for cooling high-power semiconductor and optoelectronic devices.
Silicone thermal sheet for heat transfer between electronic components.
Adhesive thermal pad for electronics cooling and component mounting.
Graphite thermal pad for cooling electronics between components and heatsinks.
Gel thermal pad for heat transfer between electronic components and heatsinks.
Self-adhesive thermal pad for cooling electronic components and processors.
Sticky thermal pad for mounting on electronic components to remove heat.
Sticky thermal pad with built-in adhesive for easy component mounting.
Copper heat pipe for cooling electronic components in industrial equipment.
Thermal gel pad for broad electronic component cooling applications.
Self-adhesive thermal pad for easy installation on electronic components.
Self-adhesive thermal pad for cooling electronics components in devices.
Thermal gel pad for cooling electronic components and processors in devices.
Non-silicone thermal sheet for electronic component heat dissipation.