A bracket that attaches connector blocks to electrical panels and control boxes for organized industrial wiring.

Siemens network switch module for connecting industrial automation and PLC systems.

Polyamide base mounting component for DIN rail enclosure system assembly.

Polyamide base housing component for DIN rail enclosure assembly.

Pin contact extraction tool for connector assembly and maintenance work.

Specialized tool for removing pin-type crimp contacts from electrical connectors.

Tiny surface-mount aluminum heatsink for integrated circuits.

Ceramic heatsink for cooling electronic components like chips and LEDs in industrial equipment.

Polyamide upper housing component for DIN rail enclosure assembly systems.

Small aluminium heatsink with adhesive backing for cooling IC chips and small electronics.

Tiny adhesive-mounted heatsink cools small IC chips in compact designs.

Large-format PID temperature controller with analog current output for SCADA and automation systems.

Ceramic square heatsink with adhesive and screw mounting for universal IC cooling.

Ceramic square heatsink with pin fin design for universal IC cooling.

Small 12V relay with standard IC socket pitch for easy circuit board integration.

Square heatsink for ball-grid-array integrated circuits with screw mounting.

Small rectangular aluminium heatsink for DIL integrated circuits and components.

Infineon PVI5080 solid state relay component for electronics applications.

Small soldered heatsink for integrated circuits and semiconductor devices.

Adhesive heatsink rapidly removes heat from small electronic chips.

Square clip-mounted black heatsink for integrated circuit thermal management.

Integrated circuit logic controller for pneumatic system control.

Small thermal interface pad for individual electronic component cooling.

Small clip-mounted square heatsink for cooling standard integrated circuits.

Adhesive-mounted aluminum heatsink for integrated circuits and BGA packages.

Square heatsink for processor or high-heat integrated circuits with adhesive attachment.

Soldered heatsink for TO-220 and TO-262 semiconductor packages.

Soldered heatsink for TO-220 and TO-262 package cooling applications.

Integrated flow sensor chip for small embedded systems and portable devices.

Adhesive-mount square aluminum heatsink for BGA and surface-mount integrated circuits.

Small aluminum heatsink with adhesive for chip cooling.

Compact clip-mounted heatsink for cooling individual power transistors.

Small clip-mounted heatsink for cooling compact power semiconductor components.

Small adhesive-backed aluminium heatsink for semiconductor thermal management.