Thin red thermal pad for transferring heat from electronics to heatsinks or components.
Thick silicone thermal interface sheet for industrial electronics and heat management.
Graphite thermal pad for reliable heat transfer and cooling between electronic components and surfaces.
Ultra-thin non-adhesive thermal sheet for efficient heat transfer in electronics.
Thin flexible silicone thermal interface sheet for compact electronics and heat management.
Ultra-thin silicone thermal pad for delicate electronics, 150x150mm.
Ultra-thin non-silicone thermal pad for tight electronic assemblies.
Medium-thickness self-adhesive thermal pad for electronics cooling needs.
Thin self-adhesive thermal pad for direct component contact cooling.
Fibreglass thermal sheet for cooling electronic devices at high temperatures.
Ultra-thin graphite thermal sheet for extreme-temperature electronics cooling applications.
Ultra-thin high-conductivity graphite sheet for superior electronics heat transfer.
Thick self-adhesive thermal sheet for large surface heat dissipation.
Non-silicone thermal sheet for moderate heat dissipation applications.
Ultra-thin self-adhesive graphite thermal interface sheet for high-performance heat transfer.
Thick non-silicone thermal pad for general electronics cooling needs.
Industrial thermal sheet for high-performance heat dissipation.
Thin polyimide thermal pad for semiconductor and circuit heat management.
Thick self-adhesive thermal pad for large-area heat dissipation and vibration damping in electronics.
Flexible thermal pad with adhesive for low heat electronics applications.
Thick adhesive thermal pad for large gap filling and heat management.
Ultra-thin polyimide thermal pad for sensitive electronics requiring minimal conductivity.
Silicone thermal sheet for heat transfer between electronic components.
Ultra-thin graphite thermal pad for exceptional heat dissipation in compact spaces.
Self-adhesive yellow thermal sheet for medium electronics heat dissipation.
Thin polyimide thermal interface for insulating yet heat-conductive electronics bonding.
Non-silicone thermal sheet for electronic component heat dissipation.
Ultra-thin high-conductivity graphite sheet for efficient heat transfer.
Large-format ultra-thin thermal sheet for minimal-gap electronic device cooling.
Ultra-thin graphite thermal sheet for maximum heat dissipation.
Adhesive thermal sheet for efficient heat dissipation in electronics.
Ultra-thin graphite thermal sheet with high heat conductivity and adhesive.
Heat transfer pad for electronics cooling, 150×150mm, operates -40 to +125°C.
Thin thermal interface pad for efficient cooling in compact electronic devices.