Fibreglass thermal sheet for cooling electronic devices at high temperatures.
Self-adhesive yellow thermal sheet for medium electronics heat dissipation.
Ultra-thin thermal interface material for high-performance heat transfer in compact assemblies.
Self-adhesive thermal interface pad for reliable heat dissipation in electronics.
Thin flexible silicone thermal interface sheet for compact electronics and heat management.
Large self-adhesive thermal interface sheet for electronic component heat management.
High-conductivity thermal interface material for LED and electronics heat dissipation.
Ultra-thin thermal interface pad for tight-fit electronics cooling.
Ultra-thin non-silicone thermal pad for tight electronic assemblies.
Medium-thickness self-adhesive thermal pad for electronics cooling needs.
Thick non-silicone thermal pad for general electronics cooling needs.
High-conductivity graphite thermal sheet for efficient heat transfer in electronics.
Thin polyimide thermal interface for insulating yet heat-conductive electronics bonding.
Self-adhesive thermal interface sheet for filling gaps between electronic components and heat sinks.
Graphite thermal pad for reliable heat transfer and cooling between electronic components and surfaces.
Thermal gel pad for cooling electronic components and processors in devices.
Thin thermal pad for cooling electronics and processors in high-temperature environments.
Soft silicone thermal pad for reliable heat transfer in electronics.
High-conductivity silicone thermal pad for efficient heat dissipation in devices.
Gel-based thermal pad for reliable heat transfer in electronic assemblies.
Silicone thermal sheet for heat transfer between electronic components.
Graphite thermal pad for cooling electronics between components and heatsinks.
Self-adhesive thermal pad for electronic component cooling and heat management.
Graphite thermal pad with excellent heat transfer for electronics cooling.
Self-adhesive thermal pad for cooling electronic components in industrial equipment.
Non-silicone thermal sheet for electronic component heat dissipation.
Thin thermal pad for spreading heat away from electronic components and devices.
Self-stick thermal pad for heat management between electronic components.
Fibreglass thermal pad for cooling electronics between -55°C and +200°C.
Adhesive thermal sheet for efficient heat dissipation in electronics.
Self-adhesive thermal pad for cooling electronics and heat dissipation in devices.
Thin red thermal pad for transferring heat from electronics to heatsinks or components.
Self-adhesive thermal sheet for industrial heat management, flexible application.
Non-silicone thermal sheet for moderate heat dissipation applications.