PUR foam sheet filter material rated G3 for custom-cut air filtration applications.
Compact solder-mounted heatsink for TO-series semiconductor package cooling.
Simple on-off main switch for single-phase electrical circuits.
Heavy-duty three-phase manual on-off switch rated 40 amps for industrial control applications.
Blue LED sensor identifies transparent bottles on production lines up to 2m away.
Heatsink compatible with multiple TO-package semiconductor form factors.
Aluminum heatsink for PGA chip packages with adhesive mounting.
Material and moisture detection sensor for industrial processing and conveyor systems.
Ultra-thin thermal interface material for high-performance heat transfer in compact assemblies.
Block-style capacitive proximity sensor for detecting various materials and liquids in industrial automation.
Compact capacitive proximity sensor for non-contact material and liquid level detection in industrial processes.
This is a non-contact sensor switch that detects liquids and materials without touching them, commonly used in factory automation and equipment control.
Aluminum heatsink for BGA chip packages with conductive adhesive.
Thermal interface strip material for LED and electronics heat management.
Small square heatsink with adhesive mounting for cooling semiconductor packages.
Clip-mounted heatsink for cooling DIP semiconductor packages in electronics.
Vertical-mounted heatsink for standard TO-220 and TO-247 transistor packages.
High-conductivity thermal interface material for LED and electronics heat dissipation.
Mixed material key padlock with keyed alike function for doors and equipment.
Optical sensor detects transparent bottles on production and packaging lines reliably.
Small screw-mounted heatsink for SOT-32 package semiconductors.
Multi-position electrical step switch for controlling power distribution in industrial circuits.
Three-phase 20A on-off switch for industrial panels and control circuits.
Thin Panasonic thermal pad for compact electronics applications.
Fiberglass thermal pad for moderate heat dissipation in electronics.
High-conductivity thermal pad for direct bonding of electronics to heat sinks and chassis.
High-voltage relay for switching 600V circuits with minimal leakage current.
Thin thermal interface pad for heat transfer between electronics components.
Thick non-silicone thermal pad for general electronics cooling needs.
Thin thermal pad transfers heat from electronics to heatsinks efficiently.
Aluminium square heatsink with conductive foil for BGA component cooling.
Thermal interface pad for electronics and device cooling applications.
Capacitive sensor detects non-metal and liquid levels with 5mm detection range.
Complete starter kit for installing and configuring Chauvin Arnoux MEMO4 energy meters.