Sprint Electric buffer card stabilizing voltage for motor control circuits.
3W buffer card with PID function for motor control and automation systems.
Self-adhesive Q-Pad thermal pad for efficient electronics heat transfer.
Self-adhesive thermal pad for CPU and electronics heat management applications.
Silicone thermal pad for cooling electronic components and industrial equipment.
Metal thermal gap pad for LED and electronics heat management and cooling.
Thin thermal pad transfers heat from electronics to heatsinks efficiently.
Thick thermal gap pad for cooling electronic components in industrial applications.
Self-adhesive gap pad thermal interface for flexible heat transfer in electronics.
Fibreglass thermal pad for small electronics components and heat dissipation.
Thick thermal gap pad for small compact electronics cooling and heat dissipation.
Thin polyimide thermal pad for heat transfer in compact electronics.
Thick thermal gap pad for large-area heat transfer in industrial electronic cooling.
High-temperature fiberglass thermal interface pad for electronic device heat dissipation.
Small thermal interface pad for cooling components in compact electronic devices.
Self-adhesive thermal interface pad for electronics heat management and component cooling.
Ultra-soft thermal pad for delicate electronics requiring minimal compression force during heat transfer.
Thin thermal pad for cooling electronics and processors in high-temperature environments.
Thin thermal interface pad for efficient cooling in compact electronic devices.
Self-adhesive thermal interface sheet for general electronics cooling and heat transfer.
Thermal pad designed for solid state relay cooling in industrial electrical applications.
Foam pad air filter for HVAC systems and air conditioning equipment.
Thin thermal pad for cooling electronic components between heat sources and heatsinks.
Small thermal interface pad for precise component-level electronic device cooling.
Medium-hardness thermal pad for general industrial electronics cooling.
Self-adhesive thermal gap pad for electronic device cooling and heat management.
Thin self-adhesive thermal pad for cooling gaps in industrial electronic devices.
Flexible thermal gap pad for general-purpose electronics heat management applications.
Self-adhesive thermal gap pad with high conductivity for compact electronic cooling.
Fiberglass thermal pad for moderate heat dissipation in electronics.
Ultra-soft thermal pad for delicate electronics, operates up to 200°C.
Self-adhesive thermal interface pad for electronic device heat dissipation and cooling.
Larger self-adhesive thermal interface pad for industrial electronics and device heat management.
Thick thermal gap pad for small high-heat electronics cooling applications.
Self-adhesive thermal pad with polyimide base for electronics heat management.
Self-adhesive thermal pad for easy electronics cooling installation.
Self-adhesive thermal interface pad for electronic components requiring moderate heat dissipation.
Self-adhesive thermal interface pad for electronics cooling with improved heat transfer capacity.
Soft sticky thermal pad for low-pressure electronics heat management.
Soft thermal interface pad for electronics, self-adhesive with low conductivity.