Thermal interface pad for electronics heat management applications.
Ultra-thin thermal interface material for high-performance heat transfer in compact assemblies.
Ultra-thin thermal interface pad for low-profile electronic component cooling.
Thin thermal pad for cooling electronics and processors in high-temperature environments.
Thin polyimide thermal interface for insulating yet heat-conductive electronics bonding.
High-conductivity thermal pad for direct bonding of electronics to heat sinks and chassis.
Thermal interface pad for electronics and device cooling applications.
Parallel-slat ventilation grille for HVAC systems and air circulation.
Thin thermal pad for transferring heat between electronic components and heatsinks.
Parallel slat ventilation grille for air conditioning systems.
Parallel slat ventilation grille for HVAC applications and equipment airflow.
Steel ventilation grille with parallel slats for industrial air conditioning.
Ultra-thin thermal interface pad for compact electronics heat dissipation.
Thin thermal interface pad for efficient cooling in compact electronic devices.
Small silicone thermal interface pad for electronics heat management.
Silicone thermal interface pad for electronics component heat management.
Thin thermal interface pad for heat transfer between electronics components.
Fibreglass thermal interface pad for small electronics cooling applications.
Brown aluminium parallel louvre for ventilation ductwork and air circulation systems.
Ultra-thin thermal interface pad for compact electronics and device cooling applications.
Self-adhesive thermal interface pad for LED and electronic component cooling.
Self-adhesive thermal interface pad for reliable heat dissipation in electronics.
Self-adhesive thermal interface sheet for filling gaps between electronic components and heat sinks.
Steel ventilation grille with parallel slats for HVAC systems and equipment cooling.
Thin thermal interface sheet for flexible heat transfer in electronics.
Fibreglass thermal interface pad for electronics heat dissipation.
Thin thermal interface pad for cooling electronic components in industrial equipment.
Graphite thermal interface sheet for electronics heat management, 113x80mm, 400W/m·K.
Small thermal interface pad for precise component-level electronic device cooling.
High-conductivity thermal interface material for LED and electronics heat dissipation.
Red thermal interface sheet for cooling electronics, 150x150mm, operates -40 to +105°C.
Ultra-thin thermal interface pad for tight-fit electronics cooling.
Non-silicone thermal interface pad for heat transfer in electronic device cooling.
Ultra-thin thermal interface sheet for precise heat transfer in compact electronics.
Thick silicone thermal interface sheet for industrial electronics and heat management.
Flexible silicone thermal interface sheet for uneven surfaces and component mounting.
Thin flexible silicone thermal interface sheet for compact electronics and heat management.
Ultra-thin thermal interface pad for large electronic components and heat transfer.
Ultra-thin thermal interface pad for small electronic components and heat dissipation.
Thermal interface strip material for LED and electronics heat management.